Oct 27: As AI, high-performance computing and GPU-intensive workloads push rack densities higher, traditional air cooling is increasingly being complemented by liquid cooling. Coolant Distribution Units are emerging as a key part of this transition, helping data centers efficiently manage heat generated by high-density computing infrastructure.
Here are five companies offering liquid cooling solutions for next-generation data centers:
Delta Electronics – GoCool-260
Delta’s GoCool-260 is a closed-loop Liquid-to-Air Coolant Distribution Unit delivering up to 260 kW per rack for high-density AI and HPC workloads. Designed to retrofits into existing air-cooling infrastructure without facility piping or raised floors, it provides direct-to-chip cooling with low power consumption (<13%) and high thermal efficiency. For maximum uptime and simple maintenance, it features redundant pumps, fans, sensors, controllers, an integrated 50-micron filter, and hot-swappable components.
Vertiv – CoolChip CDU
Vertiv’s CoolChip CDU portfolio supports high-density computing environments through liquid-to-air and liquid-to-liquid cooling configurations. Its solutions are designed for direct-to-chip liquid cooling and can be deployed across in-rack, in-row and perimeter configurations, giving operators flexibility as computing densities increase.
CoolIT Systems – AHx Series
CoolIT Systems offers its AHx liquid-to-air CDU range for AI and HPC deployments. The systems enable liquid-cooled servers to operate within traditionally air-cooled data centers without requiring facility water integration, helping operators introduce liquid cooling while making use of existing infrastructure.
STULZ – CyberCool CDU
STULZ’s CyberCool CDU supports direct liquid cooling for high-density data center applications. The system separates facility water from the technology cooling circuit and provides precise management of coolant temperature and flow, helping operators improve cooling efficiency for demanding computing workloads.
Schneider Electric – Liquid Cooling Solutions
Schneider Electric, through its Motivair portfolio, offers liquid cooling technologies including CDUs, cold plates, rear-door heat exchangers and chillers. Its solutions address a range of AI and HPC deployments, from rack-level cooling to larger data center environments.
The Road Ahead
As AI infrastructure continues to expand, liquid cooling is becoming increasingly important for managing higher heat loads efficiently. Solutions that can integrate with existing data center infrastructure while supporting high-density computing could play a significant role in helping operators transition towards AI-ready facilities.
